This is you

• Work in an engaged multi-cultural team with global footprint, co-operate with internal and external development and production partners

• Having as Package Architect the leading responsibility for functionality and performance of SiC Diodes Packages and "Bare Die" first-level interconnect technologies

• Interfacing to global package and assembly development community

• Collect technical customer needs, market trends and benchmarking information concerning SiC packages. Propose own innovative solutions

• Support all Business Group functions with SiC power package expertise

• Pro-active Package Requirements Management and road-mapping derived from product roadmaps and market trends
What you will need

• University degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or similar

• Extensive knowledge of semiconductor packages, assembly materials and assembly processes

• 5 years of experience in power package development, including experience in Clip-bonding technologies

• 3 years of experience in SiC or GaN packaging and "Bare Die" processing. Very good understanding of related technologies

• Strong skills in architectural thinking, critical judgement and fast and structured problem solving

• Energetic and result driven, technical Leader with ambition to grow

• Excellent communication skills and team player within global, intercultural environment

• Fluent Business English


This is your department and colleagues

From our Shanghai office you will work with an engaged multi-cultural team with a global footprint.

其他信息
语言要求：英语

所属部门：研发部