Major in chemistry is preferred.
化学相关专业优先
Language Skill

Ability to read and comprehend English (preferred).
有一定的英语听说能力（可优先考虑）
Qualification requirements

•Minimum of one year of relevant plating experience is required.

•至少1年电镀相关工作经验

Job Responsibilities

•Pre-plating preparation and masking of components.

•Performing chemical processing in according with provided technical data.

•Program machine for shot peening cycle(s).

•Clean and mask components prior to shot peening.

•Monitor and maintain shot peen machine and accessories.

•Perform process control testing, i.e. intensity verification, media control, etc.

•Manage inventory as required.

•Other duties as assigned.

•电镀前部件的预处理和遮盖操作；

•根据技术指导书进行电镀操作；

•喷丸的编程；

•喷丸前对部件进行清洗和遮盖；

•监控和维护喷丸机及其附件；

•进行工艺控制测试，例如：强度验证，介质控制等；

•管理所需备件耗材；

•其他分配的各项任务。

Specific Job Skills（ if any）

•Ability to calculate surface area and plating amperage.

•Safety conscious.

•能否适合接触化学物质（酸、碱等）;

•足够的安全意识。

其他信息

行业要求：全部行业
所属部门：生产部门