SUMMARY:

Quantitatively understand stress related failure in MPS products and find optimization by FEA in trouble-shooting, and predict stress risks in product design phase.

RESPONSIBILITIES:

• Mechanical or thermal stress analysis on package level & board level;

• Parametric analysis on ranking key impact factors for improved product reliability;

• Provide improvement solution for IC packaging related fracture ,fatigue, warpage, interface delamination issues through FEA simulation at both early failure and long term failure stage ;

• Classify stress related failure and accordingly the failure mechanisms;

• Optimize device & package structure or design to mitigate cracking related failure from stress ,warpage ,material , and manufacturing perspective ;

REQUIREMENTS:

• Education background : MS degree in Mechanical Engineering , Engineering Mechanics, Materials, strong in mechanics of materials & fracture mechanics; PhD is plus ;

• Hands-on experience of major FEA tools (e.g.,ANSYS, ABAQUS,Hypermesh, ,etc);

• knowledge & experience of thermal-mechanical characterization of electronic packaging materials , and mechanical behavior of the materials ;

• Knowledge of board level package ,experience of mechanical design using FEA as tool (design for manufacture ,design for reliability );

• Good team player ,and able to perform independent research & development work;

• Experience on some of the following is plus:

*big size PCB board (＞ 50*50)warpage simulation with calibrated good accuracy;

*big size BGA (＞50*50) fatigue life simulation with calibrated good accuracy;

*knowing failure modes and mechanism in advanced 2.5D/3D package , and experience in defining

their mechanical design guidelines;

*vibration simu for board level package used in AEC1 environments;

其他信息

行业要求：全部行业