Role Summary:
Package Innovation (PI) is focusing on package/process development, Package design center is under Package Innovation to cover package designs including Lead frame, Wire bond BGA, Flip Chip, Wafer Level, Panel Level packages for NXP globally.

Job Description:
- Responsible for IC package design mainly focus on substrate packages and lead frame packages in accordance with industry standards and customers’ specifications
- Work with business line, assembly team, supplier and subcon for spec review and provide technical consultation on package design related issues as needed
- Utilize package / die co-design tool for design for performance and manufacturability
- Work closely with team members to ensure that the design rules and standard notes are updated consistent with the existing process manufacturability

Qualification:
- Bachelor’s Degree or above in Electrical and Mechanical Engineering, graduated in 2022 to 2024.
- Package design experience on Wire bond BGA, Flip Chip BGA, Wafer Level, Panel Level packages are preferred, with additional experience with design of lead frame is desirable
- Knowledge of IC Package substrate and lead frame fabrication and assembly will be a plus
- Cadence SIP or PCB Layout experience using Cadence Allegro, experience with ACAD will be a plus
- Knowledge of Geometric Dimensioning and Tolerancing will be a plus
- Good English written and oral communication skill, CET-6 or equivalent is a plus
- Good sense of ownership and responsibility
- Good self-discipline & teamwork

其他信息
语言要求：英语
行业要求：全部行业