SUMMARY:

Heat dissipation quantitative analysis & heat design optimization , Component & system level heat dissipation simulation.

RESPONSIBILITIES:

• Utilize thermal simulation software such as ANSYS Icepak, FloTHERM, etc., to analyze the thermal performance of package/board and system level under various operating conditions.

• Provide thermal resistance parameters and thermal models .

• Provide recommendations for design optimization based on simulation results to enhance heat dissipation efficiency and thermal management capabilities.

• Work with design team to address thermal issues, make sure product thermal design first time right .

• Stay updated on the latest advancements in thermal simulation technologies and tools to continuously enhance the team's simulation capabilities.

• Assist in engineering material thermal property characterization .

REQUIREMENTS:

• BS or above degree in Engineering Mechanics, or engineering Materials, or electronics related;

• Hands-on experience of major FEA tools ( ANSYS, ABAQUS, Comsol , Icepak,Flotherm,etc. ) and modeling tools (e.g., Solidworks,ProE,etc);

• Experience of board level or system level heat dissipation management;

• Experience or projects related to machine learning Is plus;

其他信息

行业要求：全部行业