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更新:2024-04-14
工艺开发工程师
2-4万
苏州工业园区  | 5-10年  | 本科  | 社招
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Job Summary:

1. New Package Technology and New Platform Module Development
o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
o Good understanding of MRS and generate PRS with SCD definition.
o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
o Familiar with DFM, to secure robust manufacturability with quality requirements.
o Good understanding of power module package design rule, design rule update with new platform development.
o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).
o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
o Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
o Strong knowledge and in-depth understanding of device-package interaction.
o Effectively working with team for on time development.

2. Technical Project Management and Communication
o Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost.
o Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.
o Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time.
o Participate in all project/gate review, alignment with team.

Qualifications
1. At least 7 + years working experience in SMT/ Die attach/ Ag sintering, WB/ DS is a plus.
o Experienced areas: Power module package (transfer molded, gel filled) development, DSC experience is plus.
o Experienced packages: Transfer molded power module (Intelligent Power Module, Case Module, DSC experience is plus).
2. Education: BS or MS degree.
3. Skills:
o Fluent with English communication
o familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
4. Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing.


onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.

其他信息
语言要求:英语

所属部门:研发
工作地址
苏州-工业园区快捷半导体(苏州)有限公司1号
公司介绍
安森美(onsemi, 纳斯达克股票代码: ON)正推动颠覆性创新,帮助建设更美好的未来!公司专注于汽车和工业终端市场,正加速推动大趋势的变革,包括汽车功能电子化和安全、可持续能源网、工业自动化以及5G和云基础设施等。
安森美总部位于美国亚利桑那州凤凰城,在全球范围内拥有超过33,000名员工,公司在北美、欧洲和亚洲拥有设计中心、解决方案工程中心和制造工厂。
安森美坚持并践行对道德、环境可持续性和负责任的商业实践的承诺。
安森美苏州工厂,即快捷半导体(苏州)有限公司,是安森美在中国设立的一家封装与测试工厂,成立于2002年2月。苏州工厂主要产品有分立器件,智能模块,汽车模块和汽车高功率模块。除制造职能外,苏州工厂还设有产品与测试研发中心,封装工艺研发,可靠性和失效分析试验室。
2020年至2022年,苏州工厂连续三年荣获“大苏州最佳雇主”!
工商信息
以下信息来自
企业类型
有限责任公司(外国法人独资)
经营状态
存续
行业类型
计算机、通信和其他电子设备制造业
成立日期
2001年04月10日
注册地址
苏州工业园区苏桐路1号
统一社会信用代码
91320594726665781W
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