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更新:2021-04-01
3064246 Mechanical/Hardware Engineer - 重庆
面议
重庆  | 社招  | 招1人
已结束
职位详情

Description -

Responsibilities:

1. Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.

2. Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.

3. Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.

4. Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.

5. Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.

6. Provides guidance and mentoring to less- experienced staff members.

 

Education and Experience Required:

1. Bachelor's or Master's degree in Mechanical Engineering.

2. Typically 6-10 years experience.

 

Knowledge and Skills:

1. Using ProEngineer or other 3D CAD software as a mechanical design tool.

2. Excellent analytical and problem solving skills.

3. Experience in mechanical and thermal architecture of electronics packaging design.

4. Designing sheet metal and plastic parts and associated production tooling and processes.

5. Using CFD and thermal mockups to validate thermal solution.

6. Excellent written and verbal communication skills; mastery in English and local language.

7. Ability to effectively communicate product architectures, design proposals and negotiate options at senior management levels.

工作地址
重庆
公司介绍
惠普公司(HP Inc.)致力于创新技术缔造美好生活。通过我们的打印机、个人电脑、移动设备、解决方案和服务,惠普创造的科技新体验,妙不可言。有关惠普公司(纽交所交易代码:HPQ)的更多信息,请访问 *****************
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工商信息
以下信息来自
企业类型
有限责任公司(外国法人独资)
经营状态
存续
行业类型
批发业
成立日期
2015年03月16日
注册地址
北京市朝阳区广顺南大街8号院1号楼5层A01、B01、C01、D01单元
统一社会信用代码
91110105329591029H
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